Created in 2015 and headquartered in the Netherlands, Ampleon is shaped by nearly 60 years of RF Power leadership. The company envisions to advance society through innovative RF solutions based on GaN and LDMOS technologies. 

Ampleon is dedicated to being the partner of choice by delivering high-quality, high-performance RF products with its world-class talent. The portfolio offers flexibility in scaling design and production for any volume and addresses applications for 5G NR infrastructure, industrial, scientific, medical, broadcast, navigation and safety radio applications. 

Proven reliability, secure supply and excellent product consistency enable highest manufacturing yields for customers who benefit from Ampleon being a one-stop partner for RF power solutions. For more details, please visit www.ampleon.com.

The Back-End Technology team of Ampleon is based in Cabuyao, Philippines. You are going to be part of the team in Philippines where technologies and development engineering projects are coming together. The Philippines team is an experienced team with engaged and passionate people. This position reports to the Sr. Manager, NTI/NPI.

You will be the Sr. Engineer, NTI/NPI in Back-End Technology where you will lead and manage new technology, platform, and product introduction, either pre-development and/or development for Assembly Process focused on interconnect.

• Technical expertise: Assembly – preferably with knowledge in interconnect (any of the following; having multiple competences in interconnect is a plus): Wirebond (Au/Al/Cu)/Flip Chip/Clip Bond/Ribbon/Sinter/SMT etc.
• Application of project management approach in development such as PCP or APQP or equivalent.
• Responsible for developing new interconnect processes to support new products/packages to create new business opportunities.
• Evaluate, qualify, and introduce new process/methodology though DoE definition, in compliance with the design rules and release procedures to ensure that the product is ready for high volume production.
• Participate in establishing design rules and process roadmaps.
• Develop new tooling and define breakthrough procedures which would improve process development cycle time/efficiency.
• Provide day-to-day package/process support requirements focused on cost reduction and efficiency improvement.
• Coordinate with manufacturing/QA/process engineers and support teams to release new packages/products and transfer projects smoothly.
• Preparing and reviewing Risk Assessment (DFMEA), Design for Manufacturing (DfM) and Control Plan for NTI/NPI releases.

• A position in an international environment with over 35 nationalities working in cross-functional teams across 16 sites.
• Growth and learning opportunities to develop yourself in Ampleon.
• A variety of inspiring events throughout the year, such as various development activities, sports and many more.

We are looking for someone who has the following background and capabilities:

• Graduate with a Bachelor’s degree in Electronics Engineering, Electrical Engineering, Industrial Engineering, Manufacturing Engineering, or a related field.
• Must have at least five (5) years relevant experience in project management within electronics manufacturing, semiconductor packaging.
• Strong understanding of RF product assembly processes, SMT, die attach, wire bonding, soldering, testing, and manufacturing operations.
• Knowledge of project management methodologies and tools (PCP).
• Strong leadership, organizational, communication, and problem-solving skills.
• PMP, CAPM, Agile, or other project management certification is a plus.
• Familiarity with Lean Manufacturing, Six Sigma, APQP, PFMEA, SPC, and Process Validation methodologies.